Model conduction, switching, gate-drive, output-capacitance, and diode losses. View totals, efficiency, and thermal estimates instantly. Optimize device choice, cooling, frequency, and duty confidently today.
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This sample illustrates typical low-voltage switching conditions and the expected loss distribution from the calculator.
| Bus V | Out V | IRMS | IAVG | Duty | RDS(on) | Freq | tr+tf | Qg | COSS | Qrr | Total Loss | Efficiency |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 48 V | 24 V | 18 A | 15 A | 55% | 8 mΩ @ 25°C | 100 kHz | 55 ns | 80 nC | 400 pF | 60 nC | 4.3824 W | 98.797% |
These equations are first-pass engineering models. Datasheet curves, layout parasitics, driver strength, and soft-switching behavior can change real hardware results.
It estimates conduction loss, switching overlap loss, gate-drive loss, output-capacitance loss, reverse recovery loss, dead-time body diode loss, total loss, efficiency, and a first-pass thermal rise.
RMS current drives resistive conduction loss because heating follows current squared. Average current is used for switching and dead-time estimates where current magnitude during transitions matters more directly.
MOSFET on-resistance usually rises as junction temperature increases. Using the hotter resistance gives a more realistic conduction loss estimate than using a room-temperature datasheet number alone.
Qg loss is energy repeatedly supplied by the driver to charge the gate. COSS loss is energy tied to charging and discharging the output capacitance across the switching voltage.
It matters most in hard-switched converters, synchronous rectifiers, and bridge legs where diode or channel commutation forces stored charge to be removed during switching.
Parallel devices usually reduce conduction loss by sharing current, but they also increase total gate, capacitance, and recovery losses. The best count depends on frequency, cooling, and layout quality.
It is a quick engineering estimate using total loss and thermal resistance. Real boards can differ because of airflow, copper area, interface materials, transient loading, and neighboring heat sources.
No. Use it for screening and comparison, then confirm with datasheet curves, simulation, scope measurements, transient testing, and thermal validation on the actual board.
Important Note: All the Calculators listed in this site are for educational purpose only and we do not guarentee the accuracy of results. Please do consult with other sources as well.