Residual Stress Calculator

Pick a method, enter properties, and compute instantly. See tensile or compressive sign with units. Download results, review formulas, and validate your measurements today.

Calculator
Choose a method and fill inputs. Large screens show three columns.
Use ppm/K for CTE and microstrain for strain.

Example: Si ≈ 130–170 GPa (direction dependent).
Flat wafer means R0 → ∞, so 1/R0 = 0.
m
Use a large number for slight curvature.

Use the film’s elastic modulus.
ppm/K = 10⁻⁶/K.
ppm/K
°C
Cooling gives negative ΔT; heating positive.
Positive means tensile; negative means compressive, per formula sign.

Both compute σ = (E/(1+ν))·slope.
Example: 800 means 800×10⁻⁶ per unit sin²ψ.
Same unit as dψ. Example shown is arbitrary.
One pair per line. Lines starting with # are ignored.

Set to 0 for uniaxial strain.
Optional shear strain.
Uses plane stress relations; outputs σx, σy, τxy, principal stresses, and von Mises.
Reset
This tool provides simplified estimates and should be cross-checked with standards and lab procedures.
Example data table
Scenario Method Example inputs Typical output
Thin film on wafer Stoney Es 130 GPa, νs 0.28, ts 0.5 mm, tf 1 µm, R0 ∞, R 20 m Stress in hundreds of MPa
Cooling after deposition Thermal mismatch E 200 GPa, ν 0.30, αf 12 ppm/K, αs 3 ppm/K, ΔT −200°C Often compressive if αf>αs and cooling
XRD sin²ψ scan XRD slope E 210 GPa, ν 0.30, slope 800 microstrain per sin²ψ Order of 100 MPa
Locked-in elastic strain Strain-based E 210 GPa, ν 0.30, εx 600 µε, εy 0 µε σx ≈ 130 MPa (uniaxial)
These are illustrative ranges, not guaranteed values.
Formula used
1) Thin-film curvature (Stoney)
Best for thin films on much thicker substrates with measured curvature.
σ = (Es·ts²) / (6·(1−νs)·tf) · (1/R − 1/R0)
2) Thermal mismatch (biaxial film)
Estimates stress from constrained thermal strain due to CTE mismatch.
σ = E/(1−ν) · (αf−αs) · ΔT
3) XRD sin²ψ
Fit elastic strain vs sin²ψ; slope maps to stress.
ε = (dψ−d0)/d0, slope = dε/d(sin²ψ), σ = (E/(1+ν))·slope
4) Strain-based (plane stress)
Uses isotropic Hooke’s law to convert measured residual strains to stresses.
σx = E/(1−ν²)·(εx + ν·εy), σy = E/(1−ν²)·(εy + ν·εx), τxy = E/(2(1+ν))·γxy
How to use this calculator
  1. Pick the method matching your measurement setup.
  2. Enter elastic constants, thicknesses, and measured values.
  3. Press Calculate to view results above the form.
  4. Check the sign label for tension or compression.
  5. Download CSV or PDF for a quick report.
  6. Review the formula section for assumptions and limits.
FAQs

1) What is residual stress?

Residual stress is stress locked into a material after processing, without external loads. It may come from thermal gradients, plastic deformation, phase changes, or constrained shrinkage.

2) What does a negative result mean?

A negative value indicates compressive stress under the calculator’s sign convention. Compressive surface stress can improve fatigue resistance but may cause buckling in thin films.

3) When should I use the Stoney method?

Use it for thin films on much thicker substrates when you can measure curvature or radius before and after deposition. It’s common for wafer-based thin films.

4) How accurate is the thermal mismatch estimate?

It’s a first-order estimate assuming a biaxially constrained film and uniform temperature change. Real stress may differ due to creep, cracking, plasticity, or partial constraint.

5) Why does XRD need a slope versus sin²ψ?

The sin²ψ method linearizes how lattice spacing changes with tilt angle under stress. The fitted slope relates directly to stress through elastic constants for the chosen reflection.

6) What if my XRD fit has low R²?

Low R² suggests nonlinearity, poor d0, texture effects, or measurement noise. Try more angles, confirm peak fitting, and ensure you’re in the linear elastic regime.

7) Can I use strain-based mode for plastic strain?

This mode assumes elastic strain. If plastic strain contributes, the stress cannot be obtained by Hooke’s law alone. You may need unloading measurements or method-specific standards.

8) Which unit system should I use?

Choose MPa for most engineering metals and films. Use GPa for very stiff materials or large stresses. Keep inputs consistent and use the unit selectors for thickness and modulus.

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Important Note: All the Calculators listed in this site are for educational purpose only and we do not guarentee the accuracy of results. Please do consult with other sources as well.