Simple Sputter Yield Calculator

Model ion energy, masses, angle, and binding. Get yield, removed atoms, and thickness together instantly. Use the calculator for faster sputtering estimates and checks.

Calculated Result

Enter your sputtering inputs below. Then press calculate to show the result here above the form.

Calculator Input Form

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Example Data Table

Ion Target Energy (eV) Angle (deg) Yield (atoms/ion) Thickness (nm)
Ar+ Copper 500 0 2.5732 2.4245
Ar+ Silicon 1000 30 4.6284 11.1187
Kr+ Aluminum 1500 45 7.8532 11.7278

Formula Used

This tool uses a simple engineering estimate for sputter yield.

Y = alpha × Sn × M × ((E − Eth) / Us) × A(theta)

M = 4M1M2 / (M1 + M2)²

A(theta) = min(3, (1 / cos(theta))^0.60)

  • Y = estimated sputter yield in atoms per ion.
  • alpha = empirical efficiency factor.
  • Sn = stopping factor.
  • M = reduced mass coupling term.
  • E = ion energy.
  • Eth = threshold energy.
  • Us = surface binding energy.
  • A(theta) = angle correction factor.

If ion energy is not above threshold energy, the calculator sets sputter yield to zero. Thickness removal is then derived from removed atoms, atomic weight, density, and sputtered area.

How to Use This Calculator

  1. Enter the ion species and target material names for reference.
  2. Input ion energy and threshold energy in electron volts.
  3. Enter ion mass and target atom mass in atomic mass units.
  4. Provide surface binding energy and incidence angle from the surface normal.
  5. Set the stopping factor and efficiency factor for your process assumptions.
  6. Enter ion dose, sputtered area, density, and atomic weight.
  7. Press Calculate to view yield, removed atoms, and thickness above the form.
  8. Use the CSV or PDF buttons to export the current result.

Simple Sputter Yield in Engineering

Why sputter yield matters

Sputter yield shows how many target atoms leave a surface per incoming ion. It is a key number in plasma processing, thin film work, ion milling, and surface cleaning. Engineers use it to estimate removal rate, target wear, and coating uniformity. A good first estimate saves test time.

Main variables that control sputtering

Ion energy strongly affects momentum transfer. Higher energy usually raises sputter yield until other limits appear. Ion mass also matters. Heavy ions often transfer momentum more efficiently to the target. Target atom mass changes the collision balance. Surface binding energy resists atom removal. Stronger binding usually lowers yield.

Angle effects and process planning

Incidence angle changes how collision cascades develop near the surface. Yield often rises at moderate angles and then becomes less reliable near grazing incidence. This is why the calculator includes an angle factor but also gives a caution note at very high angles. It helps with practical planning, not final qualification.

Why density and atomic weight are included

Yield alone is useful, but thickness loss is often the engineering target. The calculator converts removed atoms into mass, volume, and thickness. Density and atomic weight make that conversion possible. This is helpful for target life reviews, etch budgeting, and comparing materials under the same ion dose.

Where a simple model helps most

A simple sputter yield calculator is best for screening studies, early design checks, and fast comparison work. It can support chamber setup, beam selection, and first-pass erosion estimates. It also helps explain trends between ion energy, incidence angle, and target properties. For production settings, always compare estimates with measured sputter data and calibrated process runs.

FAQs

1) What does sputter yield mean?

Sputter yield is the average number of target atoms ejected by one incoming ion. It is usually written in atoms per ion and helps estimate erosion and material removal.

2) Why does ion energy matter so much?

Ion energy controls how much momentum can be transferred into the target. More available energy above threshold usually increases sputter yield, although real systems can become more complex at higher energies.

3) Why is there a threshold energy input?

Threshold energy represents the minimum energy needed before sputtering becomes meaningful. If the ion energy does not exceed this level, the calculator sets the yield to zero.

4) Is this calculator suitable for all materials?

It is suitable for quick engineering estimates across many materials. It is not a replacement for measured sputter data, detailed Monte Carlo simulation, or process-specific calibration.

5) What does the efficiency factor do?

The efficiency factor lets you tune the simple model to better match expected behavior. It helps account for empirical differences that the basic equation does not fully capture.

6) Why does the angle factor increase yield?

At off-normal angles, collision cascades can deposit energy nearer the surface. That often improves atom ejection. Near grazing angles, however, real yields can deviate sharply from simple predictions.

7) How is thickness removed calculated?

The calculator converts sputtered atoms into mass using atomic weight and Avogadro’s number. It then uses density and sputtered area to convert removed mass into thickness.

8) When should I avoid relying on this estimate alone?

Avoid using it alone for final production recipes, critical device structures, or unusual materials. In those cases, measured erosion data and process calibration are essential.

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Important Note: All the Calculators listed in this site are for educational purpose only and we do not guarentee the accuracy of results. Please do consult with other sources as well.