Calculator Inputs
The page uses a single-column content flow. The input area below switches to three columns on large screens, two on smaller screens, and one on mobile.
Example Data Table
| Case | Ion | Target | Energy (eV) | Angle (°) | Surface Binding (eV) | Use Case |
|---|---|---|---|---|---|---|
| Example 1 | Ar⁺ | Cu | 800 | 45 | 3.5 | General thin film sputtering estimate |
| Example 2 | Ar⁺ | Ti | 600 | 60 | 4.9 | Oblique incidence comparison |
| Example 3 | Xe²⁺ | Mo | 1200 | 30 | 6.8 | Erosion sensitivity screening |
Formula Used
This page uses a practical semi-empirical estimator for quick engineering studies. It is intentionally transparent and tunable. It is not a substitute for full Monte Carlo sputtering simulation.
1) Mass transfer factor
λ = 4MiMt / (Mi + Mt)²
2) Threshold energy
Eth = kUs / λ
3) Screening term
S = √(ZiZt) / (Zi2/3 + Zt2/3)
4) Base yield
Y0 = C · α · S · λ · (E / Us)p · [1 − (Eth / E)2/3 ]2.5
5) Angular correction
F(θ) = [1 + A·sin(θ)2.6] · exp(−((max(0, θ − θpeak))/g)²)
6) Final yield
Y = Y0 · F(θ)
7) Thickness rate
Rate = (Y · ion rate) / (area · atom density)
What each term means:
- Mi, Mt: ion and target atomic masses.
- Zi, Zt: ion and target atomic numbers.
- Us: target surface binding energy.
- k, p, C: user-tunable fitting parameters for threshold and energy scaling.
- θ: ion incidence angle measured from the surface normal.
How to Use This Calculator
- Enter ion energy, ion mass, ion atomic number, and charge state.
- Enter the target atomic mass, atomic number, density, and surface binding energy.
- Set the incidence angle from the surface normal.
- Enter beam current, sputtered area, and process time for rate estimates.
- Adjust the advanced fitting parameters only if you need calibration against known data.
- Press Calculate Sputtering Yield.
- Review the result summary above the form, then inspect the Plotly chart.
- Use the CSV or PDF buttons to export the calculated outputs.
FAQs
1) What does sputtering yield mean?
Sputtering yield is the estimated number of target atoms ejected per incident ion. A value of 1 means one incoming ion removes about one target atom on average.
2) Why does angle matter so much?
Oblique incidence changes how collision cascades deposit momentum near the surface. Yield often rises at moderate oblique angles, then drops near grazing incidence because ions skim and deposit less useful momentum.
3) What is surface binding energy?
It is the effective energy barrier that surface atoms must overcome to leave the target. Higher values usually reduce yield because the surface is harder to eject material from.
4) Can I use this for compounds or alloys?
You can use weighted average properties for rough screening, but compounds and alloys can sputter preferentially. For critical work, validate with experimental data or dedicated simulation software.
5) Why is the yield zero sometimes?
If the incoming ion energy is below the estimated threshold energy, the threshold factor collapses. That means the model predicts negligible sputtering under those inputs.
6) How accurate is the thickness rate output?
It is a first-pass engineering estimate. Real thickness removal depends on redeposition, roughness, channeling, compound effects, and true beam profile uniformity across the raster area.
7) Should I change the fitting constants?
Only when you have reference data. The default constants are useful for comparative screening, but calibration against measured yield or simulation output will improve local accuracy.
8) Is this suitable for final process qualification?
No. Use it for quick comparisons, sensitivity checks, and planning. Final qualification should rely on measured sputter rates, literature data, or validated ion-solid simulation tools.